Technology Solutions

Zelpro Assembly Solutions stays up on the latest in technology and process to meet the latest demands in the High Tech industry.

Surface Mount, through hole and Odd Form PCB assembly.

Processes and equipment capable of processing: 0201 and larger passives, SOIC, PLCC, BGA, Fine Pitch Mirco BGA's, DPack's, Alcap, TSOP and Fine Pitch QFP's.

  • High Speed flexible Surface Mount Assembly machines

  • 2 complete assembly lines capable of handing large assemblies to the smallest micro assembly

  • Multi Zone Lead Free controlled soldering oven

  • X-Ray Inspection to 5 microns

  • Rework system for BGA and FPQFP

  • Lead Free Wave Soldering System and segregated work stations

  • Traditional Wave Soldering System

  • Inline and Batch cleaning

  • Wire Processing

Capabilities include: